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Flextech Alliance to Feature Pioneers, Innovators and Integrators at the 2012 Flexible and Printed Electronics Conference and Exhibition

Dec 18, 2012

FlexTech Alliance today announced the speakers, agenda, workshops and short course offerings for its 2013 Flexible & Printed Electronics Conference & Exhibition, to be held in Phoenix, Ariz., January 29 – February 1, 2013. At this 12th annual conference, attendees will gather perspectives from Fortune 500 companies, innovative start-ups and the organizations that are bringing the technology together to create solutions and provide practical applications. The conference and exhibition addresses the $9.5B flexible, printed electronics market, which is predicted grow to $63B by 2022, according to IDTechEx.

Opening day speakers include industry leaders Dave Edwards of Avery Dennison, Monica Davis of EMD Chemicals (Merck KGaA) and Bill MacDonald of DuPont Teijin Films who will provide their insights into major corporate innovations and new products. Aerospace applications will be revealed by Kendra Short of the Jet Propulsion Laboratory and Richard Vaia of the U.S. Air Force Research Laboratory. Ted Tohma, an OLED pioneer, along with Takuya Komoda of Panasonic Corp., Mike Hack of UDC and Keith Cook of Philips Lighting share their views on opportunities for flexible OLED displays and lighting. Industry innovators and integrators Janos Veres of PARC, Davor Sutija of Thin Film Electronics, and Kevin Dowling of MC10 will describe the latest new products and developments from the award winning companies in printed electronics. Indro Mukerjee, CEO of Plastic Logic, will describe his personal journey and challenges in transforming his company’s science project into industrial reality.

Collaboration between industry, academia and government will be showcased throughout the keynote talks, technical presentations and exhibition hall. For example, in the Biometrics and Medical Sensors session, presentations will be made from U.S. Air Force Research Laboratory, Body Media, GE Global Research and Weel Technologies in advancing human performance and biometric products. A paper from University of California, Berkeley will present a new printed electronics device that dramatically improves the sensitivity of MRI, a key diagnostic tool widely used in medicine. Physical Optics Corp. will present the results of a collaborative FlexTech Alliance-funded project to develop a medical triage bandage. This project is the launching point for an integrated platform that enables next generation physiological monitoring. A prototype device will be demonstrated in the FlexTech Alliance booth.

“The event is focused on highlighting technical breakthroughs and demonstrating products in flexible, printed electronics and displays,” said Dr. Malcolm J. Thompson, chief technical advisor at FlexTech Alliance. “This is accomplished through visionary speeches and original research presentations. The exhibit floor will feature more working demos than ever with actual products and prototypes taking center stage.”

In-depth workshops have been added to the short course line-up on Tuesday January 29, 2013. In the “Printed Electronics Meets Consumer Product Companies” workshop, attendees will learn how product packaging integrates printed electronics, resulting in new forms of consumer engagement. The “Photonic Curing: Hands-On Methods and Applications” workshop provides participants with an opportunity for hands-on processing of inkjet and screen-print depositions. In the short course, “OLED Thin Film Barrier & Encapsulation Technology”, subject matter experts from Samsung Cheil, Lotus Applied Technology, Teknek and NanoMarkets will discuss concepts for OLED displays, lighting, photovoltaics, and flexible electronics products.

Flex Conference 2013 contains 100+ presentations from world renowned organizations including Applied Materials, Corning Inc., DuPont Teijin Films, HP, Merck, PARC, Panasonic Corp., and Sharp. Product and printing demonstrations will be made by NovaCentrix, New Way Air Bearings, Sun-Tec, Frontier Industrial, FUJIFILM Dimatix, PARC, Cal Poly and Clemson University among others.

To view a full conference agenda visit www.flexconference.org .

Premier sponsors for the 2013 conference are E Ink, Kolon and the U.S. Army Research Laboratory.