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FlexTech News
FlexTech Alliance Announces Dates and Location of 2013 Flexible Electronics & Displays Conference & Exhibition
Jun 27, 2012
New metropolitan venue, expanded advisory board reflect conference and industry growth
FlexTech Alliance today announced that its 2013 Flexible Electronics & Displays Conference & Exhibition is scheduled for January 29 – February 1, 2013. The conference, now in its 12th year, is moving to the Phoenix, Arizona Convention Center to accommodate its continuous growth. The new venue will provide technologically advanced amenities in a vibrant downtown location, while maintaining the superb networking atmosphere that has long characterized the Flex Conference. With the expanded exhibit space, attendees will be able to engage with more suppliers, customers and partners in flexible, printed electronics R&D, design and manufacturing.
“FlexTech Alliance is pleased to offer our industry this exciting new venue that reflects the conference’s growth, which in 2012 was a 20% increase in attendance and a 30% increase in exhibits,” stated Michael Ciesinski, CEO, FlexTech Alliance “We will combine the best aspects of prior conferences – including high quality business and technical content, and ample networking opportunities - in an easy to access metropolitan setting.”
The Flexible Electronics & Displays Conference & Exhibition is a culmination of shared information, highlighting technical breakthroughs, demonstrating working products, and presenting successful results of FlexTech Alliance funded projects. The 2013 Flex Conference will feature over 100 business and technical presentations on topics such as wearable electronics, flexible displays, OLED displays and lighting, and smart sensors, plus product exhibitions, short courses, academic research and valuable networking events.
“The Phoenix Convention Center warmly welcomes flexible, printed electronics and display industry experts to the FlexTech Alliance conference in January 2013. Our staff and service partners look forward to accommodating every event need and exceeding attendees’ expectations in our state-of-the-art facility,” said Debbie Cotton, Phoenix Convention Center director.
Additionally, the Flex Conference now has a broadened advisory committee. “The new advisory committee members reflect industry penetration into different markets and the many applications that will benefit from this technology,” Ciesinski explained. Representatives from Avery Dennison, Qualcomm MEMS Technologies, U.S. Army Research Lab, Jabil Circuit, Inc, FLEXCon, Deloy LLC, and the City University of Hong Kong have joined the conference advisory committee. These advisors strengthen a prestigious roster of internationally known industry, academic and research organizations from Asia, Europe and North America. Conference co-chairs are from Abbie Gregg, Inc., Esstech, Inc. and EMD Chemicals Performance Materials.
Visit www.flexconference.org for a complete list of conference advisors.
The co-chairs and advisors will formulate the conference agenda beginning with identifying the most relevant topics in the industry, issuing a Call for Papers, and selecting the most informative presentations to include in the program. The Call for Papers for the 2013 Flex Conference opens in July 2012. Contact info@flextech.org for details.
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