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FlexTech News
FlexTech Alliance Awards Clemson University with Contract to Benchmark Inks and Processes for Printing Electronic Components
Jul 21, 2010 - FlexTech Alliance
Study Addresses Challenge In Transitioning Novel Materials From R&D To Roll-To-Roll Production Printing
SAN JOSE, Calif., July 21, 2010 — The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chain, today announced a new contract with Clemson University to perform research and compile a registry to benchmark processes in roll-to-roll manufacturing of printed electronics components. High speed, roll-to-roll or roll-to-sheet production printing processes require finely tuned ink systems to produce controllable products during manufacturing. The materials, along with other key variables within each process, contribute to the success of achieving quality print output. The FlexTech Alliance-funded study will examine the capability of flexography, gravure, and rotary screen printing as high-speed, commercially available roll-to-roll technologies for the manufacture of functionally active or passive advanced devices. Clemson University, equipped with its new Sonoco Institute of Packaging Design and Graphics, has considerable experience in this field, including strong partnerships in the printing supply chain as well as with end-users.
"This project creates much-needed technical reference materials for the printed electronics industry on ink material properties, ink formulation principles, and application to specified printing processes, cross-referenced with printed characteristics," said Jay Sperry, research associate at Clemson University and the Sonoco Institute. "Our research aims to provide state-of-the-art capabilities for production roll-to-roll high speed printing systems for characteristics vital to the printed electronics market, including ink film thickness, ink film smoothness, edge acuity, and resolution. Today, this information is acquired through proprietary trial and error experimentation, and it is difficult to find in one comprehensive resource."
"By initiating this project, FlexTech will support our expanded mission to help build a commercially viable industry around printed electronics,” said Michael Ciesinski, chief executive officer of FlexTech Alliance. "Clemson University quickly took a lead role in participating in and hosting our workshops, as well developing short courses, and presenting at conferences to build awareness for and participation in the emerging printed electronics industry."
“Congratulations to Clemson University, and the new Sonoco Institute of Packaging Design & Graphics, on being awarded this contract,” said Rep. J. Gresham Barrett (R-S.C.). “We are proud of the achievements of this top organization, and their taking the lead in helping to transition our printing industry into the new area of printed electronics, which has great economic potential for our district and South Carolina.”
The FlexTech Alliance program is a collaborative effort of private industry and the U.S. Army Research Laboratory, located in Adelphi, MD.
About the FlexTech Alliance
The FlexTech Alliance is the only organization headquartered in North America exclusively devoted to fostering the growth, profitability and success of the electronic display and the flexible, printed electronics supply chain. Leveraging its rich history in promoting the display industry as the U.S. Display Consortium, the FlexTech Alliance offers expanded collaboration between and among industry, academia, government, and research organizations for advancing displays and flexible, printed electronics from R&D to commercialization. To this end, the FlexTech Alliance, based in San Jose, Calif., will help foster development of the supply chain required to support a world-class, manufacturing capability for displays and flexible, printed electronics. More information about the FlexTech Alliance can be found at the industry portal: www.flextech.org.
About Clemson University and the Sonoco Institute of Packaging Design & Graphics
Clemson University, one of the country’s top public universities, combines the best of small-college teaching and big-time science, engineering and technology. The Sonoco Institute of Packaging Design & Graphics was initially created at Clemson University to exploit the synergies that exist between the Graphic Communications and Packaging Science departments. But “Packaging Design” incorporates much more than the structural and aesthetic elements that typically come to mind. Core innovation areas include:
• The Consumer Experience
• Printed Electronics
• Package Design Workflow
• Sustainability
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